前苏联专利SU1114341A3 Adhesive composition for connecting polymeric films to metal foil

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专利摘要:
ADHESIVE COMPOSITION FOR COMPOUNDS polymer films with a metal foil comprising a saturated polyester resin having terminal hydroxyl groups, an isocyanate containing at least two isocyanate groups in the molecule, and an organic solvent, wherein chta, in order to increase heat resistance, curing rate and bond strength it additionally contains an epoxy resin adduct with a compound selected from the group consisting of aromatic polyamine, menthane diamine and dicyandiamide, molecular weight 2500-8000 p The following ratio of components, May. h .: Nascent polyester resin with terminal hydroxyl groups 100 Isocyanate containing at least two isocyanate groups in 4-8 molecules The specified epoCO adduct of 5-30 resin Organic composition 15% solvent -30% concentration of composition 4 00 4
公开号:SU1114341A3
申请号:SU731988255
申请日:1973-12-19
公开日:1984-09-15
发明作者:Ватанабе Цутому；Ямаока Сигенори；Танака Коити
申请人:Сумитомо Бейклайт Компани,Лимитед (Фирма)；
IPC主号:

专利说明:

The invention relates to an adhesive composition used, in particular, to make a sheet material of a flexible printed circuit. The main requirements for devices, in connection with the development of electronic technology, are size reduction, weight reduction, high reliability of communication devices, devices, etc., simplicity of the circuit to be mounted, as well as the manufacture of circuit boards. printed circuit of light polymer film. Polymeric polyethylene, polyimide films, etc. are used as polymer films. Each of them has high mechanical, electrical, and chemical properties. Moreover, since they have high elasticity, they are preferably duplicated with metal foil and then used as a printed circuit board. However, in most cases, polymer films have little. solid surface activity; therefore, it is extremely difficult to obtain a high strength of their bond with a metal one (in the case of a printed circuit). In addition, it is very difficult to impart high circuit properties and resistance to chemical processing under harsh conditions in the manufacture and assembly of printed circuit boards, so only a small amount of adhesives are used to produce flexible printed circuits. As a cling; its method of duplicating a polymer film with a metal foil can be used a method in which both the polymer film and the metal foil are hot pressed in a press for 5-3.0 hours. However, since the starting materials are used in the form of rolls, it is preferable to use a method called dry paging, according to which glue is applied to the raw materials, then they are duplicated under pressure when passing through hot rolls. When applying this method, to obtain a laminate used in a flexible-printed circuit, it is necessary to simplify the production process to make it continuous. However, to implement the method using rolls requires an adhesive that is able to provide high adhesion, high resistance to the action of chemically active substances, electrical properties, etc., and it is necessary that the glue be cured within 0-5.0 s, i.e. For a considerably shorter period of time than in the case of pressing. Also required. so that the glue has selective properties, i.e. not agglomerated (not cured) at the leafing stage and covered all the fine roughness of the metal foil, etc. Polyester resin has good adhesion properties to various polymer films and foils of various metals, high elasticity and electrical characteristics and has advantages when used as the main resin component of the adhesive for a flexible metal-foil laminated sheet material. However, the polyester resin does not provide sufficient resistance to the action of organic solvents used in the preparation of printed circuits from laminated sheet material. In the case where an isocyanate compound is added to a polyester resin to make cross-links, the resulting product has enhanced resistance to organic solvents, but is not satisfactory for a flexible printed material. The closest in technical essence and the achieved result to the proposed is an adhesive composition comprising a linear. Saturated polyester with terminal hydroxyl groups, an isocyanate and an organic solvent used in a layered material for packaging pharmaceutical agents, which consists of a polyester film and aluminum foil, the reaction quickly It proceeds at a temperature suitable for use in a high-speed dry-sheet process and provides high durability. 1 J. m of the adhesive composition when used in a flexible printed circuit are poor rheological properties at the moment of its passage through heated rollers, as well as nonuniform adhesion and low heat resistance of the resulting laminate sheet Container material. 3 By introducing epoxy resin into the composite, it is possible to increase the heat resistance of the adhesive, but the introduction of epoxy resin alone into the mixture of polyether resin and isocyanate compound does not provide cross-linking and therefore does not achieve sufficient efficiency. Even when using an epoxy resin with a hardener, materials with poor properties are practically obtained, since a reaction between the vulcanizing agent and the isocyanate compound Neneem preferably takes place, and non-compatible materials are formed before the composition is used as an adhesive, while the epoxy compound is non-reciprocating. polyester resin remains even after duplication, and thus the resulting sheet material is extremely low resistance to action. chemically active substances. Various adhesive compositions containing polyester resin as the main ingredient should be cured after applying it to the material of the roll, as the glue adheres to the rolls of the sheet machine, and in addition, absorbs dust before paging, which results in noticeable damage to the surface of the product. The purpose of the invention is to increase the curing rate of the adhesive, the heat resistance of the adhesive compound. The goal is achieved in that an adhesive composition comprising a saturated hydroxyl-terminated polyester resin, an isocyanate containing at least two isocyanate groups in the molecule, and an organic solvent additionally contains an epoxy resin adduct with a compound selected from the group comprising an aromatic polyamine, menthandiamine and dicyandiamide, molecular weight 250 8000 with a ratio of components, weight. h .: Saturated polyester resin with terminal hydroxyl groups 100 Isocyanate containing at least two lsos. cyanate groups in a molecule4-8 41 Epoxy resin adduct Organic solvent Up to 1% 30% concentration of the composition As an isocyanate, polyisocyanate compounds containing groups such as alkyl, aryl or aralkyl can be used, and containing at least isocyanate groups in the molecule, For example, toluene diisocyanate, diphenyl methane diisocyanate, metaphenylene diisocyanate, hexamethylene diisocyanate, triphenyl methane triisocyanate, the reaction product of toluene diisocyanate and trimethylol propane or a compound, DR-, chennye poliizotsian blocking & that phenol or the like polyurethane prepolymer, obtained by the interaction of an excess of polyisocyanate with a polyol. The reactivity of the procyanate is relative to the polyester resin of the juice, the reaction proceeds very quickly, resulting in faster crosslinking and curing, and therefore this system is suitable for use in the roll method with rolls, and the chemical resistance of the polyester resin used as an adhesive is due to cross-linking. The amount of isocyanate compound used depends on its chemical equivalent and the desired degree of cross-linking. L, as epoxy compounds, can be used common epoxy compounds, such as diglycidin ethers, derivatives of bisphenol A or halogenated bisphenol A, diepoxy compounds of cyclic olefins, such as derivatives of cyclohexane, novolac gums, glycidine esters of polyphenols or polyhydroxyphenols, or anhydroxyphenols, or anhydroxyphenols, Ipodol, polyvinyl chloride esters, glycidine polyphenol esters or polyhydroxyphenol derivatives, or non-polyphenols or polyhydroxyphenols. glycidyl esters, aromatic hydroxy carboxylic acids or aromatic dicarboxylic acids, diglycidyl esters of acid dimers, diglytes simple polyalkylene glycol idyles esters, etc. 5 The epoxy equivalent of these compounds is in the range of r, 100-4000, although compounds with an epoxy equivalent of 100-1000 are preferred. If necessary, a small amount of tertiary amine, phenol, etc. can be used with these epoxy resin hardeners. To obtain an epoxy resin adduct (step B), the hardener is mixed preliminarily with epoxy resin in an organic solvent to conduct the reaction at 40-150 bodies and for 0 , 5-3 hours, and then the mixture is cooled, resulting in a lacquer based on an epoxy resin adduct. Epoxy resin in this state has the so-called characteristics of the B stage, i.e., rheological properties similar to those of a thermoplastic resin at high temperature, and when heated, the reaction proceeds up to the formation of a three-dimensional structure. Some properties can be achieved only with the introduction of the epoxy resin of stage B, which is impossible if conventional two-component systems are used — polyester resin and isocyanate — or if the two-component system is simply mixed with the epoxy compound and a hardener (so-called epoxy resin composition). stage A). The amount of injected epoxy resin of stage B is 5-30 wt. hours at 100 weight. h polyester resin. If this amount is less than 5 weight, then heat resistance and rheological properties are unsatisfactory, and if more than 30 weight. h, then unsatisfactory stanov.its adhesion. The adhesive composition may contain maleic anhydride copolymer with (di) met-sht: styrene, dibutyldyl urate of tin, zinc octylate and a pigment or dye. The copolymer interferes with the agglomeration of the adhesive and, in addition, gives it elasticity, due to the presence of a long-chain molecular structure and promotes the curing of the epoxy resin, accelerates the vulcanization, resulting in increased heat resistance and resistance to the action of chemically active substances of the adhesive. 1 The amount of copolymer used ranges from 0.5 to 20 wt. h per 100 weight. h polyester resin. Going beyond these limits entails the ability to agglomerate and a decrease in the degree of cure or decrease in chemical resistance. Metallic salts - tin dibutyldilaurate, zinc octylate - prevent the formation of agglomerates in the glue, which is due to the action of their long-chain alkyl groups, etc., in addition, they form a chelate bond, which leads to an acceleration of curing . Their number ranges from 0.01 to 5 wt. h per 100 weight. h polyester resin. The adhesive composition may also include a pigment. The boards of conventional flexible printed circuits are based on a polymer film, so most of them are white or transparent. The tendency to increase the density of electrical wiring diagrams in electronic devices causes the use of various types of printed circuit boards in one device. To avoid errors during assembly of the device, it is necessary that the parts of the circuit that carry the load or the position of the connecting elements and other parts of the printed circuit are different from each other. The pigments used are organic or inorganic with a particle size of up to 10 microns, preferably 5. The pigments prevent adhesive discoloration, loss of bond strength and elasticity over time. In the process of duplication, the adhesive composition dissolved in a solvent is applied onto a polymer film and / or metal foil, the solvent evaporates in the drying zone, resulting in the vulcanization of the adhesive composition, and then the polymer and metal foil is compressed while passing them through hot duplicate rolls, duplicated material. cooled and put on a reel. To achieve a better result, it is necessary that one of the duplicate rolls be metashtic, and the other rubber and polymer film and metal foil pass through the rolls so that the film and the foil are in contact with the metal and rubber roller, respectively. so that the foil is wound on a rubber roll with a roll circumference at an angle jr / 4 happy or more with respect to the contact line of both rolls. The feld composition can be used to duplicate various poly1-1 mer films used commonly as the basis of flexible printed circuit boards such as polyethylene terephthalate, polyethylene 2.5-naphthalate, poly. vinyl chloride, polyethylene, polypropyl polyimide, polyamidimide), etc. with a type of metal foil, such as copper, aluminum, tin-copper-beryllium, etc. The thickness of the polymer film must be 0.8 mm or less, and the total thickness of the material is 1 mm or less. m e r. In the methyl ethyl ketone, 100 weight is dissolved, part of a polyester resin with a MM of 20,000, obtained by means of an OOH denaturation, .6 mol of terephthalic acid and 0.4 mol of adipic acid with 1 mol of ethylene glycol, 8 wt. toluene diisocyanate, 10 weight parts of epoxy resin of stage B with M.M. about 4500, obtained by reacting 0.8 mol of diaminodiphenylmethane with 1 mol of diglycidyl ether bispheno on A in a solvent mixture consisting of methyl ethyl ketone and methyl cellose in the temperature range of 80-100 ° C for 2 h, and 2 wt. half polyesterified product with normal heptyl alcohol, equimolecular amount of maleic anhydride and styrene copolymer to obtain adhesive varnish with a concentration of 20 parts by weight. The resulting adhesive using a roll sheet machine, in which there is a distribution roll zone, a drying zone and a pressure zone interconnected using rollers, it is applied in a layer of approximately 30 microns onto a polyethylene terephthalate film 50 microns thick. A film coated with glue is dried at 120 ° C for 5 minutes at
They are placed on a copper foil with a thickness of 35 µm and pressed them at 150 C and a pressure of 15 kg / cm between duplicating rollers, one of which is metal and the other is rubber. With the passage, the value of the film and med1
The obtained adhesive lacquer is applied with a layer of microns to a film of polyethylene-2, 6-naphthalate 50 microns thick (manufactured by Teijin Co.). The film coated with adhesive is dried at 130 ° C for 3 minutes and then applied from 18 foliage between oak shafting rolls for 2 with the film covered with adhesive passes through the metal wadding, and the copper foil contacts the cutting roller with the metal foil is wound on a rubber roller with a circumference of the rubber roller at an angle L / 4 happy or more relative to the line of contact of both rolls, resulting in a flexible copper-clad. sheet 1- {material. Although the fastening is carried out at a low pressure in a short period of time, the material has a high bond strength, chemical resistance and electrical properties. in the case of using a conventional adhesive (comparative example 1 and 4), the resulting laminate sheet material is inferior in quinite resistance, heat resistance, bond strength, etc., and it is not possible to obtain any satisfactory performance. Example 2 obtaining an adhesive varnish with a concentration of 15% by weight; the following ingredients are dissolved in tetrahydrofuran, as in Example 1, by weight. part: Polyether resin s (co-condensation product of ethylanglycol, terephthalic acid and sebacic acid, taken in a molar ratio of 1: 0.5: 0.5) 100 Triphenyl methane triisocyanate .4 - epoxy resin and metaphenylenediamine in 1: 0.810 copolymer with copolymer maleic anhydride and dimethylstyrene, taken in a molar ratio of 1:11 to 35 mm thick copper foil and V is passed between duplicate rollers at 160 ° C and a pressure of 20 kg / cm for 1 second in example 1. While pressing is carried out 5 in short term lamination material characterized by high values of properties, particularly high heat resistance during soldering, as compared with the laminate material 10 obtained .On the basis of the use of polyethylene terephthalate film. Example 3. In order to obtain an epoxy resin adduct on an average 15 MM-6000, a reaction between equimolecular amounts of polyvolume ester of novolac resin (Epicotte R 154 produced by Shell Chemical Corp.) and dicyandiamide in a mixture is carried out. 20 solvents (methyl ethyl ketone and dimethylformamide) in the temperature range of 100-120 ° C for 3 hours. To obtain an adhesive lacquer with a concentration of 20 wt. % following four 25 component parts, weight. including said epoxy resin, dissolved in methyl ethyl ketone: Polyester resin (examples 1) 100 Toluene diisocyanate 5 Adduct of epoxy resin 15 Dibutyl di-dilaurate tin 0.1 The resulting lacquer is applied to the polyimide film of Example 1 and dried at 110 ° C for 5 minutes. The film coated with adhesive is applied to the copper foil by passing them between the rollers at a pressure of 25 kg / cm for 3 seconds. Example 4. In order to obtain an adduct with an average No. 1-2500, a reaction between equimolecular amounts of cycloaliphatic epoxy resin and methane diamine in methyl ethyl ketone is carried out at a concentration of menthandiamine 27 wt.% At 60-80 ° C for 1 hour. A 30 glue paint is prepared. weight. % The following four components, weight. including the said epoxy resin, dissolved in a solvent mixture of methyl ethyl ketone and toluene: 1114341 not the first 10 euros of the skin 10 Polyester resin of Example 2 Example 100 Diphenylmethane diisocyanate Adduct of epoxy resin and menthandiamine 5 Zinc oxylate 0.05 Glue obtained the lacquer is applied with a polyvinyl chloride film, supra for 3 minutes, the film with the copper roll rolls is duplicated at a pressure of kg / cm for 1 s. Example 5. To obtain a clear lacquer, the three components of the adhesive positions of example 1 are replaced by the following components, weight. h, and a half lacquer is applied to a film of potassium terephthalate: Polyester resin (a product of co-condensation of ethylene glycol, propylene glycol and terephthalic acid, taken in a molar ratio of 0.5: 0.5: 1) Polymethylene polyphenyl polyisocyanate Epoxy resin adduct and methane adducts 1: 1 MM 8000 The film coated with adhesive is duplicated with copper foil using duplicate rolls, as in Example 1. Example 6. A composition different from Example 1 by the absence of a copolymer of maleic anhydride and styrene and the presence of 2 wt. Particles of titanium dioxide with a particle size of about 5 microns are applied to a film of polyethylene terephthalate, which is duplicated with a copper foil of Example 1. The resulting copper-slag laminate material is subjected to accelerated wear tests according to Jis-Z-2030. The irradiation times are 100 and 200 hours; the latter value corresponds to exposure to atmospheric conditions for approximately one year. Example 7. Adhesive varnish is prepared analogously to example 1 based on the same components, but without a copolymer of maleic anhydride and styrene. Example 8. The adhesive composition is similar to Example 2, the copolymer of maleic anhydride and dimethyl styrene is replaced by 10 wt. including phthalocyanine green with a particle size of 0.5 Ikm. The resulting adhesive composition deposited on a film of polyethylene-2,6-naphthalate. The film coated with glue is duplicated with the copper foil of example 2. Example 9. Glue composi- tion is obtained on the basis of the same ingredients as in example 3, but 5 parts by weight of dibutyltin is replaced. soot with a particle size of 2 µm and applied to a polyimide film. The film coated with the adhesive is duplicated with the copper foil of Example 3 using an all-rounder roller, and as a result, colored flexible copper-clad laminated sheet material is obtained. Example 10. Glue composition similar to example 4, but with 2 weight. including ferrocyan blue, applied to a film of polyvinyl chloride. The film coated with the adhesive is duplicated with the copper foil of Example 4, resulting in a color flexible honey-clad laminated sheet material. Example 11. The adhesive composition according to example 3 is applied to a polyimide film 50 μm thick and dried at 130 ° C for 5 minutes. The film is duplicated with a copper foil with a thickness of 35 μm at a pressure of 40 kg / cm for 60 minutes using a hot press, the result is a flexible copper-laminated laminated sheet material. Example 12. In order to obtain the epoxy resin B of the stage with the average MM, the reaction between the diglycidyl ether of bisphenyl A adduct and propylene oxide, 0.8 mol of hexahydrophthalic anhydride, 0.1 PH 2-ethyl-4-methyl imidazole in methyl ethyl ketone at 60-80 ° C for 30 min. For the preparation of adhesive varnish concentration / 25 wt. % the following components, weight. hours, including said epoxy resin, dissolved in methyl ethyl ketone: polyester resin (Example 12) 100; block isocyanate, in which the reaction product of trimethylolpropane with toduyl ndisocyanate is masked with phenol; epoxy resin (reaction product of stage B) - 25; a copolymer of maleic anhydride and styrene, which is semi-aurified with normal butyl alcohol, taken in a molar ratio of 1: 1, 5; a white pigment based on titanium oxide (with a particle size of 5) 5, the obtained adhesive lacquer is applied to a 100 µm thick polyethylene terephthalate film and an adhesive coated film duplicated with an aluminum foil 100 µm thick according to example 1, resulting in a flexible aluminum laminate laminated sheet material. Example 13. A flexible printed circuit with a circular contact is obtained by etching on the basis of a layered material according to Example 5. Separately, the same adhesive composition is applied onto a 25 micron thick polyertilenterephthalate film, dried at 120 ° C for 5 minutes, after which films corresponding to the pad are punched. The film treated in this way is combined in an appropriate way with the said flexible printed circuit and is pressed at 150 ° C and a pressure of 30 kg / cm-Within 40 minutes to glue the film to the pattern. The resulting closed printed circuit board contains on the copper foil a contour scheme completely placed in the coating layer covered with glue, the glue does not appear on the unprotected area of the contact pad and the printed circuit coating is good. Chemical reagents, such as, for example, solder during soldering, do not fall on the boundary part of the top layer of the printed circuit. When soldering is carried out at 240 ° C, it is peeled off, and the printed circuit thus obtained is of high quality. Example 1 (comparative) The adhesive composition of example 5, but without an epoxy resin adduct, was applied to the polyethylene terephthalate film by the method of example 1. Then the film was glued to the copper foil using hot rolls. At the moment of passing through the sheet machine, the glue's rheological properties are extremely low and it is not able to ensure uniform gluing over the entire surface of the material being duplicated. As can be seen from the table. 1, the obtained layered sheet material is noticeably inferior in chemical resistance and heat resistance. Example 2. (comparative) 100 weight.h. epoxy resin of Dianova (Epicet R 1001, manufactured by Shell Chemical Chemical Corp.) and 8 parts by weight (equimolecular amount) are dissolved by mentandiam in a mixture of methyl ethyl ketone and methylcellosolva solvents and the resulting solution is applied to a 50 µm thick polyethylene terephthalate film. The film with glue is dried at 130 ° C for 5 minutes, put on a copper foil 35 µm thick, glued to the latter by hot pressing at 160 ° C and a pressure of 60 kg / cm for 120 minutes using heated press. The obtained layered sheet material is significantly inferior in bond strength (0.2 kg / cm) and the copper-laminated material does not possess high elasticity. Example 3. (comparative). To obtain an adhesive composition, the composition of Example 5 is used, which does not contain an epoxy resin adduct, but an equimolecular mixture of snoic resin and mentandiamine. However, the isocyanate and the diamine, present in the mixture, react with each other to form insoluble material before the mixture is used. After removing the insoluble part by filtration using the remaining composition, a copper-lacquer-based material based on polyethylene terephthalate film of Example 1 was obtained. The resulting layered material is significantly inferior in chemical resistance and is not suitable for use as a main board of a flexible printed circuit. Example 4. (comparative). Polyurethane solution obtained by the interaction of 100 weight. h, polyester resin used in example 5 with 10 weight. including toluene diisocyanate in tetrahydrofuran at 80 ° C for 1 h, applied to a film of polyethylene terephthalate. A separately mixed solution of epoxy resin used in comparative example 1 and 3, and a hardener applied on a copper foil, Medn: ™ the foil is dried at 130 ° C for 5 min; and then combined with the specified polyester film coated with a polyurethane solution, and duplicate them at 160 ° C and a pressure of 60 kg / cm for 120 minutes on a heated press, the result is a flexible sheet material. The layered material is inferior in adhesion to the material obtained in Example 5. When using this type of glue in a roll sheet machine, the layer of epoxy resin does not have time to cure for a short period of time and the chemical resistance of the material obtained is significantly reduced. In tab. 1 presents the properties of the materials in examples 1-12 and 1-4 (comparative); in tab. 2 - the results of tests of materials for accelerated wear (data characterizing resistance to actual atmospheric conditions). Thus, due to its high adhesion, rheological properties, electrical characteristics, etc. For this adhesive composition, it can be used as an adhesive layer for a conventional coating film used for insulation, for anti-corrosion purposes and for anti-bending protection of a conductive material of a flexible printed circuit, it can be used when applying a coating layer using 1-roll rollers after the composition was applied to the polymer film.
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table 2

权利要求:
Claims (1)
[1]
GLUE COMPOSITION FOR COMBINING POLYMER FILMS WITH A METAL FOIL, including a saturated polyester resin with terminal hydroxyl groups, an isocyanate containing at least two isocyanate groups in the molecule, and an organic solvent, characterized in that, with the aim of increasing heat resistance and speed, the compound she additionally
100 contains an epoxy adduct with a compound selected from the group consisting of aromatic polyamine, menthandiamine and dicyandiamide, molecular weight 2500-8000 in the following ratio, May. hours:
Hydroxylated Polyester Resin
Isocyanate containing at least two isocyanate groups in the molecule
Specified Epoxy Adduct
Organic solvent
4-8
5-30
Up to 15-OX concentration of the composition
SU <„1114341 ί

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同族专利:

公开号 | 公开日

SU843762A3|1981-06-30|

GB1424269A|1976-02-11|

DE2363259A1|1975-01-16|

FR2234360A1|1975-01-17|

JPS5016866A|1975-02-21|

CH587884A5|1977-05-13|

US3896076A|1975-07-22|

JPS556317B2|1980-02-15|

AU465064B2|1975-09-18|

IT1000374B|1976-03-30|

CA1033871A|1978-06-27|

AU6355473A|1975-06-19|

DE2363259B2|1977-05-18|

FR2234360B1|1976-10-08|

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法律状态:

优先权:

申请号 | 申请日 | 专利标题

JP6880273A|JPS556317B2|1973-06-20|1973-06-20|

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